| 摘要 |
An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened. |
