HOLLOW RESIN CASE FOR HOUSING SEMICONDUCTOR CHIP

摘要

A hollow resin case for housing a semiconductor chip, which is composed of: a hexahedral container part that has a cavity for housing a semiconductor chip and is formed from a resin composition that contains a filler and a liquid crystal polyester which contains repeating units respectively represented by formulae (1), (2) and (3) below and which contains, when the total amount of the repeating units (1), (2) and (3) is taken as 100% by mole, 40-75% by mole of a repeating unit that contains a 2,6-naphthylene group; and a rectangular plate-like cover part for sealing the cavity-side surface of the container part. The container part and the cover part are hermetically sealed by sealing after a semiconductor chip is housed in the cavity. (1) -O-Ar1-CO- (2) -CO-Ar2-CO- (3) -O-Ar3-O- In the formulae, Ar1 represents a 2,6-naphthylene group, a 1,4-phenylene group or a 4,4'-biphenylylene group; Ar2 and Ar3 each independently represents a 2,6-naphthylene group, a 1,4-phenylene group, a 1,3-phenylene group or a 4,4'-biphenylylene group; and each of the hydrogen atoms in the groups respectively represented by Ar1, Ar2 and Ar3 may independently be substituted by a halogen atom, an alkyl group or an aryl group.