SHEET FOR FORMING PROTECTIVE FILM FOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sheet for forming a protective film for a chip with which a highly reliable semiconductor device can be manufactured even when exposed under severe heat and humidity conditions while easily forming the protective film having highly uniformity and excellent thermal conductivity on a reverse surface of the chip.

SOLUTION: The sheet for forming the protective film for the chip includes a release sheet and a protective film forming layer formed on the release sheet. The protective film forming layer comprises (A) a binder polymer component, (B) a curable component, and (C) an inorganic filler, and the thermal conductivity of the protective film forming layer is 0.5-8.0 W/m.K.

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