发明名称 COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICES, COPPER ALLOY THIN PLATE, AND CONDUCTIVE MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a copper alloy excellent in stress relaxation resistance as a Cu-Zn-Sn-based copper alloy for conductive components of electronic/electric equipment such as connectors or other terminal materials, and also excellent in various properties such as strength, rollability, bendability, electrical conductivity or the like. <P>SOLUTION: The copper alloy contains, by mass, 23-36.5% Zn, 0.1-0.8% Sn, &ge;0.05% to <0.15% Ni, &ge;0.005% to <0.10% Fe and 0.005-0.05% P, wherein the atomic ratios of the mutual element contents satisfy 0.05<Fe/Ni<1.5, 3<(Ni+Fe)/P<15 and 0.5<Sn/(Ni+Fe)<5, and the balance Cu with inevitable impurities. Besides, Co of &ge;0.005% to <0.10% may be added. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012158829(A) 申请公布日期 2012.08.23
申请号 JP20110030908 申请日期 2011.02.16
申请人 MITSUBISHI MATERIALS CORP 发明人 MAKI KAZUMASA;MORI HIROYUKI
分类号 C22C9/04;H01B1/02;H01B5/02 主分类号 C22C9/04
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