发明名称 |
CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE |
摘要 |
A semiconductor device comprising a semiconductor die that is embedded in a package, wherein the die has a front side comprising a plurality of pads to be bonded to terminals of the package, and wherein a backside of the die is coupled to a backside surface of the package by a thermal bridge.
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申请公布号 |
US2012211895(A1) |
申请公布日期 |
2012.08.23 |
申请号 |
US201213366607 |
申请日期 |
2012.02.06 |
申请人 |
TEXAS INSTRUMENTS DEUTSCHLAND GMBH |
发明人 |
LANGE BERNHARD;PUCHERT THIES |
分类号 |
H01L23/538;H01L21/56 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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