发明名称 |
Embedded Semiconductor Device Including Phase Changeable Random Access Memory Element and Method of Fabricating the Same |
摘要 |
Disclosed are an embedded semiconductor device including a phase changeable random access memory element and a method of fabricating the same. A semiconductor chip including a main memory element and a supplementary memory element is integrated on a substrate, intrinsic chip data are obtained by electrically testing the semiconductor chip, and the semiconductor chip is packaged. The intrinsic chip data are written into the supplementary memory element before the packaging of the semiconductor chip, and a memory layer of the supplementary memory element is formed of a material exhibiting an improved data retention property under thermal environmental conditions as compared with a memory layer of the main memory element.
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申请公布号 |
US2012214262(A1) |
申请公布日期 |
2012.08.23 |
申请号 |
US201213401550 |
申请日期 |
2012.02.21 |
申请人 |
YU TEAKWANG;KIM YONGTAE;SHIM BYUNGSUP;LEE YONGKYU;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YU TEAKWANG;KIM YONGTAE;SHIM BYUNGSUP;LEE YONGKYU |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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