发明名称 SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing method capable of drying and processing a substrate successfully without damaging a pattern on the substrate. <P>SOLUTION: An intrusion prevention liquid is supplied to a surface Wf of a substrate, then a liquid to be frozen is supplied to the surface Wf of the substrate to allow a HFE to remain in a patten gap and in the vicinity of the pattern. The HFE maintains its liquid state, the liquid to be frozen is frozen and the surface Wf of the substrate is frozen except the inside of the pattern gap and the neighbor region. Next a frozen film is sublimed and dried to expose a surface of the intrusion prevention liquid and remove the intrusion prevention liquid, simultaneously. The surface Wf of the substrate can be dried without damaging the pattern by removing the frozen film in the removing step. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012160682(A) 申请公布日期 2012.08.23
申请号 JP20110021354 申请日期 2011.02.03
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 HANAWA YOSUKE;MIYA KATSUHIKO;KITAGAWA HIROAKI
分类号 H01L21/304 主分类号 H01L21/304
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