SUBSTRATE FILM AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to a substrate film and a method for manufacturing the substrate film. The present invention provides a substrate film displaying excellent heat resistance and dimensional stability, and the substrate film has excellent stress relaxivity, enabling prevention of breakage of a wafer due to residual stress, suppression of damage or splash on the wafer due to uneven impression of pressure during wafer processing, and excellent cuttability. Therefore, the substrate film of the present invention can be used effectively as a processing sheet in various wafer processing including dicing, back grinding, or pick-up.