发明名称 |
LEITERPLATTE MIT MEHREREN ÜBEREINANDER ANGEORDNETEN LEITERPLATTENLAGEN MIT EINER BARE-DIE-MONTAGE FÜR DEN EINSATZ ALS GETRIEBESTEUERUNG |
摘要 |
A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer. |
申请公布号 |
DE112010002548(A5) |
申请公布日期 |
2012.08.23 |
申请号 |
DE20101102548T |
申请日期 |
2010.10.15 |
申请人 |
CONTI TEMIC MICROELECTRONIC GMBH |
发明人 |
SCHUCH, BERNHARD;GRUEBL, WOLFGANG;TRAGESER, HUBERT;SAUERBIER, JUERGEN;ROBIN, HERMANN-JOSEF |
分类号 |
H05K1/02;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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