| 摘要 |
<P>PROBLEM TO BE SOLVED: To selectively etch even a concave part with such a size that etching with proximity field lights is difficult, by radiation of lights. <P>SOLUTION: In this substrate surface planarization method, a concave part formed on a surface of a substrate is etched. A resist 5 is coated on a surface 2a of a substrate 2 to expose a convex part 3. Then, propagation lights with longer wavelength than absorption edge wavelength of a gas molecule 6 of etching gas are radiated on the substrate 2 in an etching gas atmosphere. At that time, on the surface of an exposure part 4 of the convex part 2 exposed from the resist 5, the gas molecules 6 are dissociated by the radiated propagation lights through a heat insulation process, so as to etch the exposure part 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
