发明名称 METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern, by which a pattern obtained by development is thermally deformed so as to stably correct fine roughness in the resist pattern feature within such a range that the line width of the pattern is not changed by over 10%. <P>SOLUTION: A method for forming a resist pattern includes steps of: obtaining a resist film of a positive chemically amplified resist composition; subjecting the resist film to pattern exposure; developing the pattern; and correcting a pattern feature by heating in such a range that the line width of the pattern obtained by development is not changed by over 10%. The positive chemically amplified resist composition comprises: (A) a resin which includes an acidic functional group protected by an acid-labile group, and which is alkali-insoluble or hardly soluble with alkali and changed into alkali-soluble when the acid-labile group leaves; (B) an acid generator; and (C) a compound containing nitrogen as a basic component. The composition contains a softening accelerator by 2.5 to 20 mass%, which has an acidic functional group protected by an acid-labile group and has a molecular weight of 800 or less. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012159585(A) 申请公布日期 2012.08.23
申请号 JP20110017840 申请日期 2011.01.31
申请人 SHIN ETSU CHEM CO LTD 发明人 MASUNAGA KEIICHI;WATANABE TAKESHI;WATANABE SATOSHI;DOMON HIROMASA
分类号 G03F7/40;C07J9/00;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/40
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