| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that in some environments, gold plating becomes brittle and can cause the failure of connections on electronic components. <P>SOLUTION: In some embodiments, a method removes gold plating on an electronic component. The method includes: forming a gold and solder mixture on an electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure. <P>COPYRIGHT: (C)2012,JPO&INPIT |
