| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for printed wiring boards, which is suitably applied to a semi-additive method when a printed wiring board is manufactured, has high adhesiveness to a conductor circuit, forms a resin layer having a surface with small surface roughness, and has excellent heat resistance; and to provide a prepreg using the resin composition, a laminated board, a resin sheet, a printed wiring board, and a semiconductor device. <P>SOLUTION: The resin composition includes, as essential components, (A) an epoxy resin, (B) a cyanate resin, and (C) carboxylic acid-modified acrylonitrile butadiene rubber. <P>COPYRIGHT: (C)2012,JPO&INPIT |
