Mould module with sensor element

摘要

The mold module i.e. mold package (102), has a printed circuit board (104), and pressure- and/or temperature insensitive components (106, 108), a pressure sensor (110) and a pressure- and/or temperature sensitive element supported by the circuit board. A molding compound (114) encloses the circuit board. A portion (116) of the circuit board is held free from the molding compound. The portion of the circuit board includes the pressure sensor and the pressure- and/or temperature sensitive element such that the pressure sensor and the pressure- and/or temperature sensitive element are exposed. Independent claims are also included for the following: (1) a method for manufacturing a mold module (2) a tool for manufacturing a mold module.