Light-Emitting Device Package and Method of Manufacturing the Same

摘要

A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate (110); a Zener diode (150) mounted on a first region of the wiring substrate; a light-emitting device chip (130) mounted on the first region and a second region of the wiring substrate; and a molding member (120) for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.