Methods of depositing aluminium layers

摘要

This invention relates to the deposition of aluminium layers or films on a thin substrate. The method includes placing the substrate on the support; depositing a first layer of aluminium onto the substrate with the substrate in an unclamped position; and clamping the substrate to the support and depositing a second layer of aluminium continuous with the first layer wherein the second layer is thicker than the first layer and the second layer is deposited at a substrate temperature of less than 22°C.