发明名称 |
METHOD FOR FABRICATING A DUAL POLYGATE IN SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE: A dual-poly gate formation method of a semiconductor device is provided to reduce electrical deterioration due to lattice defects induced within a silicon lattice using silicon which is same material with the silicon within a poly-silicon layer. CONSTITUTION: A gate insulating layer and a poly-silicon layer(110) are formed on a semiconductor substrate(100) having a first area(A) and a second area(B). The poly-silicon layer of the second area is exposed. A first ion injection process which makes the poly-silicon layer of the second area amorphous is executed. A second ion injection process which dopes impurities of second conductive type on the poly-silicon layer of the second area is executed. Impurities of the first area and the second area are activated by heat-treating the semiconductor substrate.</p> |
申请公布号 |
KR20120092948(A) |
申请公布日期 |
2012.08.22 |
申请号 |
KR20110012893 |
申请日期 |
2011.02.14 |
申请人 |
SK HYNIX INC. |
发明人 |
CHA, JAE CHUN;JIN, SEUNG WOO;LEE, AN BAE;JOO, YUNG HWAN;JANG, IL SIK |
分类号 |
H01L21/8238;H01L21/336;H01L29/78 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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