发明名称 |
Formation of alpha particle shields in chip packaging |
摘要 |
A structure fabrication method. First, an integrated circuit including N chip electric pads is provided electrically connected to a plurality of devices on the integrated circuit. Then, an interposing shield having a top side and a bottom side and having N electric conductors in the interposing shield is provided being exposed to a surrounding ambient at the top side but not at the bottom side. Next, the integrated circuit is bonded to the top side of the interposing shield such that the N chip electric pads are in electrical contact with the N electric conductors. Next, the bottom side of the interposing shield is polished so as to expose the N electric conductors to the surrounding ambient at the bottom side of the interposing shield. Then, N solder bumps are formed on the polished bottom side of the interposing shield and in electrical contact with the N electric conductors.
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申请公布号 |
US8247271(B2) |
申请公布日期 |
2012.08.21 |
申请号 |
US20080200352 |
申请日期 |
2008.08.28 |
申请人 |
ANDRY PAUL STEPHEN;CABRAL, JR. CYRIL;RODBELL KENNETH P.;WISNIEFF ROBERT L.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRY PAUL STEPHEN;CABRAL, JR. CYRIL;RODBELL KENNETH P.;WISNIEFF ROBERT L. |
分类号 |
H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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