DEVICE INSPECTION APPARATUS

摘要

PURPOSE: An element inspection device is provided to effectively execute element inspection by inspecting the bottom of an element in the state picking up the element after inspecting the element of a wafer state. CONSTITUTION: A wafer ring loading unit(100) loads a wafer ring in which elements are attached. An element inspection unit(200) receives the wafer ring from the wafer ring loading unit and executes a surface inspection for the elements attached to the wafer ring. A pickup tool(510) picks up the element from the wafer ring finishing the surface inspection in the element inspection unit. An unloading unit(300) settles elements having fair quality in a tray. An empty tray unit(400) settles elements having defects in the tray. A wafer ring transferring unit draws out the wafer ring from the wafer ring loading unit and transfers the wafer ring to the element inspection unit.