| 摘要 |
A rectangular-shaped interlevel connection structure is defined to electrically connect a first structure in a first chip level with a second structure in a second chip level. The rectangular-shaped interlevel connection structure is defined by an as-drawn cross-section having at least one dimension larger than a corresponding dimension of either the first structure, the second structure, or both the first and second structures. A dimension of the rectangular-shaped interlevel connection structure can exceed a normal maximum size in one direction in exchange for a reduced size in another direction. The rectangular-shaped interlevel connection structure can be placed in accordance with a gridpoint of a virtual grid defined by two perpendicular sets of virtual lines. Also, the first and/or second structures can be spatially oriented and/or placed in accordance with one or both of the two perpendicular sets of virtual lines. |
