| 摘要 |
Methods and devices for solar cell interconnection are provided. In one embodiment, the method includes physically alloying the ink metal to the underlying foil (hence excellent adhesion and conductivity with no pre-treatment), and by fusing the solid particles in the ink on the surface (eliminating any organic components) so that the surface is ideally suited for good conductivity and adhesion to an overlayer of finger ink, which is expected to be another adhesive. In some embodiments, contact resistance of conductive adhesives are known to be much lower on gold or silver than on any other metals.
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