发明名称 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A wiring board and a manufacturing method thereof are provided to obtain superior high frequency characteristics of a wiring board by preventing the increase of conductor loss due to skin effect. CONSTITUTION: A flat core material(20) formed of epoxy resin containing glass fiber is arranged on a wiring board(10). A laminate in which an insulating layer and a conductor layer(40,41) are alternately laminated are arranged on both sides of the core material. A solid conductor pattern connected to a fixed potential such as a power supply voltage or ground potential is formed in each conductor layer.
申请公布号 KR20120092050(A) 申请公布日期 2012.08.20
申请号 KR20120012894 申请日期 2012.02.08
申请人 NGK SPARK PLUG COMPANY LIMITED 发明人 HIGO KAZUNAGA;IGARASHI HIDEMASA;ARAKAWA MASATSUNE;YAMADA ERINA;SUZUKI KENJI;ANDO TOMOHITO;SATO HIRONORI;TORII TAKUYA
分类号 H05K3/46;H05K1/09;H05K3/24 主分类号 H05K3/46
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