SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

摘要

PURPOSE: A solid state image pickup device and a manufacturing method thereof are provided to suppress delamination or crack of a high refractive member by removing a part of an insulation layer to reduce stress. CONSTITUTION: Four photo diodes(101-104) converts incident light into charges according to the intensity of the incident light. A first transmission transistor(105) transmits charges generated from a first photo diode to a FD node(109). A second transmission transistor(106) transmits charges generated from a second photo diode to the FD node. A third transmission transistor(107) transmits charges generated from a third photo diode to the FD node. A fourth transmission transistor(108) transmits charges generated from a fourth photo diode to the FD node.