| 摘要 |
FIELD: physics. ^ SUBSTANCE: three-dimensional integrated circuit device has a first chip which is laid on a second chip to form a layered structure, each of the chips having elements constructed therein, and the chips are connected to each other by a plurality of interlayer connections which form space between the first and second chips. The device also has a through-hole through the substrate, filled with heat-conducting material, which is located in the first chip. The second chip has a heat-conducting layer, wherein the heat-conducting layer provides a physical interconnection between the second chip and the through-hole through the substrate located in the first chip. ^ EFFECT: improved removal of heat from problem areas of a three-dimensional integrated circuit device. ^ 14 cl, 4 dwg |
