| 摘要 |
PURPOSE: A method for probing chips of a wafer is provided to accurately grasp the location of the chips by searching a setting pattern at the total 5-branches. CONSTITUTION: A setting pattern is searched at the total 5-branches(S200). A wafer is sewed to a plurality of chips while being attached to an adhesive film. The sewed pattern of the plurality of chips is calculated through the searched location of the 5-branches(S300). The plurality of chips is respectively probed by grasping the each location of the plurality of chips through the calculated pattern(S400).
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