PACKAGE FOR EMBEDDING RF SEMICONDUCTOR CHIP

摘要

PURPOSE: An RFID semiconductor chip embedded package is provided to efficiently suppress electromagnetic interference due to an RF semiconductor chip by arranging a passive device for impedance matching on the upper side of a top shield layer. CONSTITUTION: A first insulation layer(200) is formed on a first metal pad layer(100). A bottom shield layer(260) made of metal materials is formed on the first insulation layer. A first via(150) conducted with the first metal pad layer is formed by passing through the first insulation layer. A second insulation layer(310) is formed on the bottom shield layer. An RF semiconductor chip(400) is located on the second insulation layer to overlap the bottom shield layer.