ULTRATHIN WAFER MICRO-MACHINING METHOD AND SYSTEM BY LASER RAIL-ROADING TECHNIQUE

摘要

PURPOSE: An apparatus and method for finely processing a wafer using a laser rail-roading process are provided to maximize the accuracy and quality of a process by forming or cutting a pattern using multi beams. CONSTITUTION: A light radiating unit(110) radiates multi light beams on the surface of an object(500). The object is arranged on a stage(120) and includes a wafer(510) and a thin film(520). A transfer unit(130) moves the light radiating unit and the stage. A nozzle(140) removes foreign materials and byproducts from the surface of the object.