METHOD FOR CLEANNING WAFER

摘要

PURPOSE: A wafer cleaning method is provided to prevent contaminants removed from a wafer from being reattached to the surface of another wafer. CONSTITUTION: A cleaning bath(110) receives cleaning solutions for cleaning a wafer(W). An ultrasonic generator(130) generates an ultrasonic wave of a preset frequency band. The ultrasonic generator includes a vibrator(131) and a control unit(135) which applies power to the vibrator. A guide unit(140) is arranged in the cleaning bath to support the wafer. A slot(141) is formed along the guide unit at a predetermined distance.