| 摘要 |
PURPOSE: A laser scribing method and a laser processing apparatus are provided to form a proper modified area and prevent damage to a device formed in a substrate when scribing the substrate with laser beam. CONSTITUTION: A laser scribing method comprises a first step of projecting pulse laser beam onto a brittle substrate, scanning a predetermined cutting line, and forming a modified layer(M) along the predetermined cutting line and a second step of projecting a laser beam, scanning along a predetermined cutting line with a focusing position fixed, and periodically forming a plurality of linear processing traces(10) propagating from the modified area to a depth before the surface of the brittle substrate.
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