发明名称 |
ANODIC BONDING APPARATUS, METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE |
摘要 |
An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.
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申请公布号 |
US2012206998(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213361115 |
申请日期 |
2012.01.30 |
申请人 |
NUMATA MASASHI;SUGAMA KAZUYOSHI |
发明人 |
NUMATA MASASHI;SUGAMA KAZUYOSHI |
分类号 |
H01L41/053;B29C65/18;C09J5/00;G04C11/02;H03B5/36 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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