| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring substrate in which an electrode of a semiconductor element is bonded to a connection pad arranged on an insulation substrate via a solder bump, and an air gap between the connection pad and the electrode caused by electromigration is suppressed. <P>SOLUTION: A wiring substrate has: an insulation substrate 1 having a mounting part 1a for an electronic component element; a through conductor 3 formed from the mounting part 1a to the inside of the insulation substrate 1; and a connection pad 2 made of copper or an alloy whose main component is copper, and adhered from an upper face of the insulation substrate 1 to an end part of the through conductor 3, and to which an electrode 5 of a semiconductor element 4 is bonded via solder 6. In a region adhered to the end part of the through conductor 3 in a plan view, a metal layer 8 made of nickel or an alloy whose main component is nickel is adhered to an upper face of the connection pad 2. Due to the metal layer 8, migration of the connection pad 2 is suppressed, and due to a copper component of the connection pad 2 bonded to the solder 6, the migration of the connection pad 2 can be suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
