摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of grasping progress of processing in real time to detect a termination point of time of processing with accuracy, in substrate processing for forming a thin film on a substrate surface. <P>SOLUTION: A substrate processing device 10 forming an insulating film 2 on a substrate 1 has: interference light generation means 12 irradiating the insulating film 2 with wavelength variable monochromatic light s and making respective catoptric light from the insulating film 2 and the substrate 1 interfere with each other; a reference wavelength setting part 28 setting a reference wavelength λ<SB POS="POST">0</SB>of the monochromatic light s so that an interference light intensity I at a desired film thickness is the minimum; a modulator 26 modulating the monochromatic light s with respect to a wavelength, between two wavelengths (λ<SB POS="POST">1</SB>and λ<SB POS="POST">2</SB>) provided on both sides of the reference wavelength; an interference light detector 18 detecting the interference light intensity I depending on the modulated monochromatic light s; and termination point of time detection means 20 detecting a point of time where a difference ΔI of the interference light intensities at the maximum wavelength (λ<SB POS="POST">2</SB>) and at the minimum wavelength (λ<SB POS="POST">1</SB>) becomes zero or a predetermined value as a termination point of substrate processing, based on the change in the interference light intensity I from a time immediately before the insulating film 2 reaches the desired film thickness to a time when the insulating film 2 reaches the desired film thickness. <P>COPYRIGHT: (C)2012,JPO&INPIT |