发明名称 SUBSTRATE PROCESSING APPARATUS, AND METHOD OF DETECTING TERMINATION POINT OF TIME OF SUBSTRATE PROCESSING
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of grasping progress of processing in real time to detect a termination point of time of processing with accuracy, in substrate processing for forming a thin film on a substrate surface. <P>SOLUTION: A substrate processing device 10 forming an insulating film 2 on a substrate 1 has: interference light generation means 12 irradiating the insulating film 2 with wavelength variable monochromatic light s and making respective catoptric light from the insulating film 2 and the substrate 1 interfere with each other; a reference wavelength setting part 28 setting a reference wavelength &lambda;<SB POS="POST">0</SB>of the monochromatic light s so that an interference light intensity I at a desired film thickness is the minimum; a modulator 26 modulating the monochromatic light s with respect to a wavelength, between two wavelengths (&lambda;<SB POS="POST">1</SB>and &lambda;<SB POS="POST">2</SB>) provided on both sides of the reference wavelength; an interference light detector 18 detecting the interference light intensity I depending on the modulated monochromatic light s; and termination point of time detection means 20 detecting a point of time where a difference &Delta;I of the interference light intensities at the maximum wavelength (&lambda;<SB POS="POST">2</SB>) and at the minimum wavelength (&lambda;<SB POS="POST">1</SB>) becomes zero or a predetermined value as a termination point of substrate processing, based on the change in the interference light intensity I from a time immediately before the insulating film 2 reaches the desired film thickness to a time when the insulating film 2 reaches the desired film thickness. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012156456(A) 申请公布日期 2012.08.16
申请号 JP20110016533 申请日期 2011.01.28
申请人 BUNKOH-KEIKI CO LTD 发明人 SATO HIROSHI;AMANO TAKASHI
分类号 H01L21/3065;G01B11/06 主分类号 H01L21/3065
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