POWER SEMICONDUCTOR MODULE

摘要

A power semiconductor module (100) is provided with: electrode plates (2) having an integrated body (2a) and an external connection terminal (2b), the bodies (2a) being in a coplanar arrangement; a semiconductor element (1) carried on one surface (carrying surface) (2c) of the body (2a); and a resin package (3) in which the other surface (radiating surface) (2d) of the body (2a) is exposed, and the semiconductor element (1) and the body (2a) of the electrode plates (2) are sealed using a resin. The radiating surface (2d) and a bottom surface (3a) of the resin package (3) are coplanar. It is thereby possible to improve heat-radiating performance and reliability as well as to reduce size.