LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING THEREOF

摘要

The present invention is a method of manufacturing a laminated substrate by laminating a base substrate and a bonding substrate with an insulation film interposed therebetween, wherein the method is characterized in comprising: a porous layer forming process for forming a porous layer partially on a laminating face of the base substrate, or forming a porous layer having a different thickness at a portion thereof; an insulation layer forming process for forming, by changing the porous layer into insulation film, an insulation film having a different thickness at a portion thereof on the laminating face of the base substrate; a laminating process for laminating the base substrate and the bonding substrate with the insulation film interposed therebetween; and a film-thinning process for forming a thin film layer by making the laminated bonding layer a thinner film. Provided, in such a way, is a method of manufacturing a laminated substrate, wherein an insulation film can be made to have a different thickness at a portion thereof, with an easy method.