发明名称 Preparing metallizations made of three-dimensional plastic parts, comprises selectively preparing conductive layer, selectively constructing galvanic metallization, and connecting plastic part by connecting part with flexible carrier
摘要 <p>The method comprises selectively preparing a conductive layer, selectively constructing a galvanic metallization, and connecting a plastic part (3) by a connecting part (2) with a flexible carrier (1), which attaches one or both sides to the respective plastic part to reach a temporary concatenation of the plastic parts so that an electrical conductive compound is prepared between the carrier and the plastic part to a supply of current for the galvanic metallization by the connecting part. The plastic parts of the connecting part are integrally formed. The method comprises selectively preparing a conductive layer, selectively constructing a galvanic metallization, and connecting a plastic part (3) by a connecting part (2) with a flexible carrier (1), which attaches one or both sides to the respective plastic part to reach a temporary concatenation of the plastic parts so that an electrical conductive compound is prepared between the carrier and the plastic part to a supply of current for the galvanic metallization by the connecting part. The plastic parts of the connecting part are integrally formed. The connecting parts are mechanically clamped with the carrier at formations and/or recesses of the carrier. The formations and/or recesses are regularly introduced into the carrier. The connecting part is connected along a material weakening as predetermined breaking point with the plastic part. Two carriers are connected with the plastic part. The parallel carriers are connected through webs (6) arranged between the neighboring plastic parts. The webs are connected with the plastic part. The carrier is commonly coiled with the connected plastic parts on a packing body. A separate, reusable plastic tape is commonly coiled as spacer with the carrier so that it gives an alternating layer of the plastic tape as well as the carrier. The carriers and/or the webs are connected with the spacers, which have a height transverse to a main extension of the carrier and are measured so that the plastic parts comprise a sufficient distance to each other in the rolled state of the carrier, which is made of an electrical non-conductive material and plastic. The conductive compound between the connecting part and the carrier and/or between the connecting part and conductive regions of the plastic part is generated by: a thin chemical metallization based on a preceding selective activation; and producing a conductive surface according to previous selective surface roughening. The carrier is electrically contacted by a sliding contact. The connecting part is connected along a contoured line with the carrier whose length is measured larger than the extension of the connecting part in longitudinal direction of the carrier. The galvanic metallization is performed in an electrolytic bath, in which the carrier in the rolled state is contacted in a front-side manner. The plastic parts in a chemical and galvanic metallization process are covered with a conductive layer and are subsequently a corroding resist made from tin. In addition, insulation trajectories are introduced by the lasers in such a way that exposed areas the conductive layer is finally corroded. An optical position detection of the plastic parts is performed. The webs and/or formations are detected into the carrier for a position determination. The connecting parts are disconnected along the breaking point and/or the material weakening by a mechanical separation process or by an electromagnetic radiation form the plastic part.</p>
申请公布号 DE102011050131(B3) 申请公布日期 2012.08.16
申请号 DE20111050131 申请日期 2011.05.05
申请人 LPKF LASER & ELECTRONICS AG 发明人 LANGE, BERND;JOHN, WOLFGANG;ROESENER, BERND
分类号 C25D5/56 主分类号 C25D5/56
代理机构 代理人
主权项
地址