| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method therefor, capable of reducing the area of an electrode pad portion while securing stable electrical contact of the electrode pad portion. <P>SOLUTION: The semiconductor device includes: a semiconductor substrate; and on the principal surface of the semiconductor substrate, a semiconductor chip electrode pad portion and a TEG electrode pad portion PT at least formed in either one of an element formation region and a dicing line region in a plan view. The semiconductor chip electrode pad portion and the TEG electrode pad portion PT include a surface OSF for electrically connecting to the outside, and also include a groove portion THP extending in an oblique direction to a side SID of the semiconductor chip electrode pad portion and the TEG electrode pad portion PT. <P>COPYRIGHT: (C)2012,JPO&INPIT |
