| 摘要 |
<P>PROBLEM TO BE SOLVED: To form solder bumps uniformly and prevent failures in the connection with a semiconductor element in a multilayer wiring board including a lamination structure in which at least one conductor layer and at least one resin insulation layer are alternately laminated and multiple conductive pads protrude from the resin insulation layer forming a surface of the lamination structure. <P>SOLUTION: A metal layer, in which first openings having first opening diameters are formed, and a resin layer, in which second openings having second opening diameters that are larger than the first opening diameter and an outer diameter of a conductive pad are formed, are laminated so that the first openings respectively communicate with the second openings, thereby forming a mask. Then, a solder paste is supplied to the conductive pads, which are formed so as to protrude from a surface of the resin insulation layer, through the mask on at least the one resin insulation layer and reflow soldering is performed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
