| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a tape carrier for a semiconductor device which prevents the generation of foreign objects due to an adhesive and the adherence of the foreign objects to a copper foil layer, thereby improving the yield. <P>SOLUTION: A manufacturing method of a tape carrier for a semiconductor device 1 includes: a process in which a backing layer 6 is bonded to a surface of an insulation film 2, which is opposite to a surface where a copper foil layer 3 is formed on the insulation film 2, through an adhesion layer 4; and a process in which holes for transportation are formed along a longitudinal direction of the insulation film. In the manufacturing method, the adhesion layer has a non-formation region where the adhesion layer is not formed in a region spaced a predetermined distance away from a side surface of the exposed insulation film that is exposed to an etchant. <P>COPYRIGHT: (C)2012,JPO&INPIT |
