| 摘要 |
<p>In this sputtering target assembly, a sputtering target-backing plate bonded body (B), as a rectangular target board having a width of 100 mm or more and a length of 1,000 mm or more, is configured by dividing a target into three or more target pieces (A) by having the dividing lines in the width direction, and by bonding the divided target pieces (A) in the longitudinal direction on a backing plate, and furthermore, three or more bonded bodies (B) are aligned in the width direction. The sputtering target assembly is characterized in that, at the time of aligning the bonded bodies (B), the dividing lines among the three target pieces in each of the bonded bodies (B) are disposed such that the lines are not at the positions same as those of the dividing lines among the adjacent divided target pieces. The present invention addresses the problem of providing the sputtering target assembly that is capable of reducing failures due to generation of particles due to a piece bonding portion, specifically, the sputtering target assembly for FPD.</p> |
