| 摘要 |
The present invention discloses a method for packaging an LED emitting light omnidirectionally and an LED package. The present invention utilizes a transparent glue to bond LED chips and electrodes onto one or more transparent glass or organic film, and vertically, or slantingly (with an angle between 0 and 60 degrees), fixes the transparent bracket having the LED chips, electrodes and welding wires in a transparent vessel. When the diode power is on, the front face of the LED chips on the vertical transparent bracket can emit light properly, while the rear face of the LED chips can emit brighter light via the transparent glass or organic film. The present invention makes it possible to demonstrate the brightest face of an LED, and thus improves LED light extraction. |
