| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser beam machining method by which even when laser beam overruns an outer peripheral edge of a workpiece such as a wafer and an adhesive tape is irradiated with the overrun laser beam, or a fully-cut groove is formed in the workpiece and the adhesive tape is irradiated with laser beam, an through hole is prevented from being formed in the adhesive tape with the workpiece being affixed thereto. <P>SOLUTION: The laser beam machining method performs laser beam machining on a workpiece using a laser beam machining apparatus which includes a holding table for holding the workpiece, a laser beam irradiation means for irradiating the held workpiece with laser beam, and a machining/feeding means for relatively performing the machining/feeding of the holding table and the laser beam irradiation means. The laser beam machining method includes a workpiece affixing step of affixing the workpiece to an annular frame, a workpiece supporting step of forming a water layer on a holding surface of the holding table and supporting the workpiece on the water layer via an adhesive tape, and fixing the annular frame, and a laser beam machining step of performing the laser beam machining on the workpiece supported by the holding table, by performing machining/feeding while the workpiece is irradiated with the laser beam from the laser beam irradiation means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
