发明名称 |
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS |
摘要 |
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders. |
申请公布号 |
US2012205425(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213447906 |
申请日期 |
2012.04.16 |
申请人 |
GRUBER PETER A.;HENDERSON DONALD W.;KANG SUNG K.;SHIH DA-YUAN |
发明人 |
GRUBER PETER A.;HENDERSON DONALD W.;KANG SUNG K.;SHIH DA-YUAN |
分类号 |
B23K1/20 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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