发明名称 EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which, even when used under high-temperature environment, achieves little decrease in elastic modulus and mass when made into a cured product. <P>SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a phenol resin, and (C) an antioxidant, wherein (B) the phenol resin contains a phenol resin obtained by the reaction of a dihydroxybenzene derivative and an aldehyde compound. Preferably, (B) the phenol resin contains a compound represented by general formula (I). In formula (I), R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each a hydrogen atom, a substituted or unsubstituted 1-18C hydrocarbon group, or a substituted or unsubstituted 1-18C hydrocarbonoxy group, and a plurality of R<SP POS="POST">1</SP>s and R<SP POS="POST">2</SP>s may be the same or different from each other; R<SP POS="POST">3</SP>is a hydrogen atom or a substituted or unsubstituted 1-18C hydrocarbon group, and a plurality of R<SP POS="POST">3</SP>s may be the same or different from each other; n is an integer of 0-20; and ms are each independently an integer of 0 or 1, wherein the sum of n and m is 1 or more. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153887(A) 申请公布日期 2012.08.16
申请号 JP20120001681 申请日期 2012.01.06
申请人 HITACHI CHEMICAL CO LTD 发明人 OGIWARA HIROKUNI;FURUSAWA FUMIO;NAKAMURA SHINYA
分类号 C08G59/40;C08K5/13;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/40
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