RESIN COMPOSITION, PREPREG, LAMINATE, RESIN SHEET, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having excellent impregnation ability to a base material and producible of a prepreg and a laminate excellent in a low thermal expansion property, moldability, and heat resistance; and to overcome difficulties in production of the varnish by preventing increase in thixotropy of vanish.

SOLUTION: The resin composition includes the following components as essential components: (A) an epoxy resin; (B) a filler; and (C) fine particles treated with a surface-treating agent and having the average particle diameter of 5-100 nm.

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