| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit, capable of reducing transmission loss of a conductor pattern and improving operability for mounting components. <P>SOLUTION: In a suspension substrate 1 with a circuit, a metal foil 4, a first base insulating layer 5, a conductor pattern 8, and a cover insulating layer 11 are sequentially formed on a metal support substrate 2. At the same time, the metal foil 4 is formed so as not to face each wiring 17 in the thickness direction in a notch 19 of the metal support substrate 2 and so as to face each wiring 17 in the thickness direction in a section except the notch 19. In a section where each wiring 17 does not face the metal foil 4 and faces the notch 19, the whole underside of the wiring 17 is covered by the first base insulating layer 5 and whole area of the top face and lateral face is covered by the cover insulating layer 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
