| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that it is difficult to remove the dust sticking to a cut surface only by conventional sucking, since, in a cutting/splitting step of an aggregate substrate by a cutter such as a router, the dust generated at the time of micro-joint cutting sticks to a substrate cut surface, and the sticking dust can be released from the cutting surface as time passes and sticks to a circuit board surface, which is required to be removed in advance. <P>SOLUTION: A substrate transportation chuck includes a chuck mechanism part which grasps a substrate, after the aggregate substrate is cut with the micro-joint, and a static eliminator brush which, while the chuck mechanism part grips the substrate, scraps a foreign substance sticking to the cut surface of the micro-joint of the substrate for removing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
