发明名称 |
Support for Wafer Singulation |
摘要 |
A support substrate or chuck 20 supports wafer die 11 during and after dicing of a wafer 10. The support substrate comprises an array of islands 21, upper faces of which are raised above a major face of the support substrate for alignment with an array of dies on, or singulated from, the wafer. Spacing between the islands is not less than a kerf of a laser, or a width of a blade, used to dice the wafer. For laser dicing the upper faces of the islands are a sufficient height above the major face that energy of a laser beam 30 used to dice the wafer is dissipated in channels between the islands without substantially machining the support substrate.
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申请公布号 |
US2012208349(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US20070223046 |
申请日期 |
2007.02.01 |
申请人 |
O'HALLORAN JOHN;TULLY JOHN;DIGGIN BILLY;TOFTNESS RICHARD F.;ELECTRO SCIENTIFIC INDUSTRIES, INC. |
发明人 |
O'HALLORAN JOHN;TULLY JOHN;DIGGIN BILLY;TOFTNESS RICHARD F. |
分类号 |
H01L21/78;B23B31/30;H01L21/683 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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