| 发明名称 |
BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME |
| 摘要 |
A bump includes a metal pillar formed over a structural body; and a diffusion barrier member formed to cover at least a portion of a side surface of the metal pillar.
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| 申请公布号 |
US2012205797(A1) |
申请公布日期 |
2012.08.16 |
| 申请号 |
US201113339123 |
申请日期 |
2011.12.28 |
| 申请人 |
BAE JIN HO;PARK MYUNG GUN;HYNIX SEMICONDUCTOR INC. |
发明人 |
BAE JIN HO;PARK MYUNG GUN |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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