| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat radiation when a double sided substrate, which is formed by adhering metal plates to both sides of an insulative substrate, is used to form an electronic apparatus. <P>SOLUTION: In a thick copper substrate 50 forming a transformer 10, a patterned first copper plate 52 is adhered to one surface of an insulative substrate 51, and a patterned second copper plate 53 is adhered to the other surface of the insulative substrate 51. Heat radiation members 40, 41 radiate heat generated in the thick copper substrate 50. The first copper plate 52 having a larger heat value, from among the first copper plate 52 and the second copper plate 53, is placed close to the heat radiation members 40, 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
