SEMICONDUCTOR PROCESSING SHEET

摘要

A semiconductor processing sheet contains a base layer having a plastic sheet containing pigment as a core layer, wherein a non-pigment-containing layer is arranged in the outermost layer on front and back main surfaces of the core layer. According to the present invention, in a process for manufacturing semiconductor devices, it is possible to minimize contamination of the inner surface for the film manufacturing die that is due to the pigment contained in the film while maintaining the visibility of the semiconductor processing sheet. Consequently, partial occlusion of the die lip aperture due to pigment contamination is reduced, with the result that effective prevention of the deterioration of the sheet thickness precision due to adhering pigment is possible.